N
NCH · Robot
Non-Contact Hand Robot for surface-safe wafer transport. Air-pressure pickup with non-slip fluorine pad — protecting product surfaces in semiconductor and other delicate processes.
2,126Sets delivered
13Sites
Across Product, Quality, Equipment, Warehouse, Process and Shipment, our 2025 portfolio integrates NCH, IMS, MES, ERP, AI and GTP into a single intelligent platform.
Six functional layers, one unified solution stack — engineered for the realities of global manufacturing.
Each item plays a specific role across the manufacturing flow — and they integrate seamlessly with one another.
Non-Contact Hand Robot for surface-safe wafer transport. Air-pressure pickup with non-slip fluorine pad — protecting product surfaces in semiconductor and other delicate processes.
Information Management System — production-equipment interface with equipment control, big-data collection and MES/ERP mutual control across global factories.
Global Intelligence Manufacturing Execution System with full ERP integration — digitalizing equipment and process information for Smart Factory at scale.
AI System and AI Chip Design with AI Platform mutual control — extending MES, ERP and global factory interfaces with intelligence.
Global Intelligence Test Pin — product-inspection interface for 6G, CPU, GPU and battery testing. Delivered to leading global customers worldwide.
Global Health AI System — Health AI Chip with SoC, sensors, IoT health watches and a web platform connecting hospitals, family and local emergency services.
GMES Framework runs across Web, App and Client — connecting MES & ERP DB, IMS Server and equipment in a single coordinated stack.
Standardized monitoring, batch, scheduler and deployment for production teams across plants.
The middleware backbone connecting application, database and equipment layers.
Real-time equipment interface and IMS workstation for monitoring & control.
Mutual control across the line — Loader, Bonder, Transfer, Reflow, Plasma, MUF, PMC, SBM, EOL and more — all coordinated by IMS.
Loader · Bonder · Transfer · Dual Reflow · Unloader — interfaced via IMS for full traceability.
Back B/G · Die Sawing · PCB W/Marking · Plasma — synchronized through IMS workstation.
1st / 2nd / 3rd inspection, EVI and End-of-Line with IMS data capture and LOT control.
Gas (O2, Ar+H2, Ar) facility control, MUF, PMC, SGN, SBM and Laser Marking.
LOT start by 2D barcode at Loader1, end by auto program at Singulation, with LOT card label print.
Stop or release decisions driven by alarms and conditions across the line — automatically.
PCB start signal, Wafer ID, X/Y coordinates, LOT ID, work numbers, good Q'TY and end signal.